Product Marking Notification

Reference Product, Package Marking (PDF) to review illustrations and descriptions of product marking for the following packages used by Apex Microtechnology.

Package Description Package Character Designation
7-Pin DDPAK, Surface Mount CC
7-Pin TO220 CD
8-Pin TO3 CE
Modular 30-Pin DIP, 1.3 Spacing CL
JEDEC MO-127, 60-Mil Pin CR
JEDEC MO-127, 60-Mil Pin, Copper CU
7-Pin TO220, Staggered Leads CX
12-Pin Power Dip, High Voltage CW
JEDEC MO-127, High Voltage DC
10-Pin Power Dip, 60-Mil Pin DE
24-Pin PSOP (JEDEC MO-166) DF
20-Pin PSOP (JEDEC MO-166) DK
12-Pin Power SIP DP
8-Pin Power SIP DQ
7-Pin SIP DR
10-Pin Ceramic SIP DW
8-Pin PSIP, 90° Formed Leads EC
12-Pin PSIP, 90° Formed Leads EE
18-Pin DIP, 25-Mil Pin EL
11-Pin ZIP EN
8-Pin PSIP, Gull Wing Leads EP
12-Pin Molded Plastic SIP EU
Modular 42-Pin DIP, 1.3 Spacing FC
Modular 34-Pin DIP, 1.3 Spacing FD
10-Pin Power SIP FL
10-Pin PSIP, 90° Formed Leads FU
8-pin DIP SMT Long GD
14-pin DIP SMT GE
8-pin DIP SMT Short GF
14-pin Hermetic Ceramic DIP HC
20-lead Ceramic LCC HD
44-Pin HSOP Slug Down (JEDEC MO-166) HR
44-Pin HSOP Slug Up (JEDEC MO-166) HU
Modular 58-Pin DIP, 2.3 Spacing KC
8-pin DIP KD
42-Pin Modular DIP, 1.4 Spacing KF
58-Lead Double Sided Modular Dip, 2.3" Spacing KN