The PA165 is a high density power amplifier IC that utilizes MOSFET technology and a proprietary silicon design to deliver new benchmarks in performance and thermal management for power amplifier ICs. With a body of just 20mm x 20mm, this device is capable of providing 4A output current continuously, and up to 10A PEAK on voltage supplies up to 200V. The PA165 uses separate supplies for the amplifier core and the output stage to help optimize overall power dissipation capabilities of 28W of internally generated heat. Thermal efficiency is further enhanced by the PQ style package featuring a heat slug on top that simplifies the mounting of a single heatsink over a single IC or an “array” pattern of these devices. Onboard protection for the PA165 includes a user-defined, temperature compensated current limit and a temperature sensor output. The addition of an output disable function and an over current flag simplify the implementation of robust failure protections on the system level.